PRECISION NITI AND
NITI-X SOLUTIONS
Khanjur R&D is a thin format NiTi and NiTi-X solutions company. We design and manufacture custom nickel-titanium based (NiTi and NiTi-X) shape memory alloys (SMAs) using proprietary physical vapor deposition (PVD) and precision laser-structuring of thin-films, foils, and sheets.
Our platform enables customers to engineer materials with tailored mechanical, thermal, and functional performance for demanding applications.
Transforming the future
From rapid prototyping to scalable production, our platform helps engineers bring complex device concepts to life.
Our innovative manufacturing processes support rapid iteration from laboratory to pilot scale, allowing partners to evaluate thin format NiTi and NiTi-X material behaviors, geometries, and product integration pathways early in development. Khanjur’s patent pending research and commercial scale manufacturing methods can be adapted for deployment at scale.
FREESTANDING THIN-FILM NITI-X
Laser-Cut NiTi from
Commercial Sheet
THIN-FILM NITI-X ON A SUBSTRATE
OUR MANUFACTURING AND MATERIAL TECHNOLOGY PLATFORMS
Khanjur develops custom nickel-titanium (NiTi and NiTi-X) shape memory materials using advanced thin film and precision laser manufacturing to enable high-performance actuation, sensing, and thermal systems. We combine deep materials science expertise with proprietary manufacturing processes to deliver application-specific solutions across multiple length scales.
Laser Manufacturing of Superelastic and Shape Memory Alloys
Our rapid precision laser platform structures custom NiTi and NiTi-X devices from thin films and commercial NiTi sheets, strips, and foils, with thicknesses from 20–500 µm.
Laser structuring provides a flexible pathway for feasibility studies and high-volume production of functional NiTi devices.
Thin-Film Manufacturing of NiTi and NiTi-X Materials
We deposit custom NiTi and NiTi-X shape memory alloy thin films using precision physical vapor deposition (PVD). Our thin-films can be deposited onto a variety of semiconductor, metal, and polymer substrates with thin-film NiTi-X thicknesses ranging from 200 nm to 10 µm.
Our platform also supports freestanding thin-films films with thicknesses from 5–80 µm.
Custom NiTi-X SMA Alloy Engineering
We develop thin-film ternary and quaternary NiTi-X alloys (X = Cu, Hf, Co, and others) to tailor functional material performance like transformation temperature, force output, fatigue life, and electrical behavior.
Our materials are custom engineered to exhibit superelastic, shape memory, and elastocaloric effects.
Laser Manufacturing of Superelastic and Shape Memory Alloys
Our rapid precision laser platform structures custom NiTi and NiTi-X devices from thin films and commercial NiTi sheets, strips, and foils, with thicknesses from 20–500 µm.
Laser structuring provides a flexible pathway for feasibility studies and high-volume production of functional NiTi devices.
Thin-Film Manufacturing of NiTi and NiTi-X Materials
We deposit custom NiTi and NiTi-X shape memory alloy thin films using precision physical vapor deposition (PVD). Our thin-films can be deposited onto a variety of semiconductor, metal, and polymer substrates with thin-film NiTi-X thicknesses ranging from 200 nm to 10 µm.
Our platform also supports freestanding thin-films films with thicknesses from 5–80 µm.
Custom NiTi-X SMA Alloy Engineering
We develop thin-film ternary and quaternary NiTi-X alloys (X = Cu, Hf, Co, and others) to tailor functional material performance like transformation temperature, force output, fatigue life, and electrical behavior.
Our materials are custom engineered to exhibit superelastic, shape memory, and elastocaloric effects.
Transforming the future
Technology Realization
Our three complementary manufacturing pathways are optimized
for different integration strategies, length scales, and performance requirements.
Selecting the appropriate manufacturing method depends on the Customer’s device architecture, required thickness, mechanical loading conditions, electronic compatibility, and scalability needs.
Our team works closely with customers
to determine the most effective pathway
Thin Film NiTi-X
Manufacturing on Substrate
Thickness 200 nm to 10 µm
Thin films ranging from 200 nm to 10 µm can be deposited onto a wide variety of substrates and integrated directly within MEMS and NEMS device stacks. These materials can be positioned beneath, above, or alongside electronic layers to enhance actuation, sensing, compliance, or thermal functionality.
Through careful control of composition, microstructure, and interfacial engineering, we ensure compatibility with advanced thin film stacks and support integration with dissimilar materials.
Freestanding Thin Film NiTi-X Manufacturing
Thickness 5 µm to 80 µm
Using proprietary release techniques, we fabricate freestanding NiTi and NiTi-X films from 5 µm to 80 µm in thickness.
Freestanding films maintain precise alloy control while enabling structural flexibility independent of rigid substrates. They can be transferred, laminated, or integrated into hybrid assemblies and are particularly valuable when mechanical compliance, conformability, or structural independence is required. Thin-film NiTi-X materials can be combined with other thin-film materials to allow direct integration into flexible and traditional printed circuit boards.
Freestanding Thin Film NiTi-X Manufacturing
Thickness 5 µm to 80 µm
Our rapid precision laser manufacturing process structures:
- Commercial NiTi foils and sheets
- Custom NiTi-X alloys
- Freestanding thin films
- Substrate-supported films
With thicknesses ranging from 20 µm to 500 µm, laser structuring supports macro- and mesoscale applications requiring structural strength, moderate cycle requirements, and rapid iteration.
This method enables complex geometries and application-specific designs while preserving functional behavior including superelasticity, shape memory response, and elastocaloric performance.
Schedule a Consultation Today
Whether you are a university, government entity or a private company, we can help you to develop, improve or deploy new technology based on your own unique needs and goals.